Xray every one of them.

Best regards,

John Burke
 

> On Sep 19, 2016, at 2:52 PM, Joey Rios <[log in to unmask]> wrote:
> 
> Sections 7.5.14, 15 and 16 outlines inspection of hidden solder joints, invoking the use of X-Ray in the Space Addendum. The standard does not explicitly prescribe a sampling extent, so, if an assembly has dozens of the same device, like 50-100 say of such devices (such as a bottom termination component) on a single PWA, is the expectation (J-STD intent) that each of the replicate devices are inspected by X-Ray?? Is that what the industry practices, or is sampling commonly invoked, since the processing of the board is the same for the entire PWA??