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September 2016

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Subject:
From:
Joey Rios <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joey Rios <[log in to unmask]>
Date:
Mon, 19 Sep 2016 16:52:35 -0500
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Sections 7.5.14, 15 and 16 outlines inspection of hidden solder joints, invoking the use of X-Ray in the Space Addendum. The standard does not explicitly prescribe a sampling extent, so, if an assembly has dozens of the same device, like 50-100 say of such devices (such as a bottom termination component) on a single PWA, is the expectation (J-STD intent) that each of the replicate devices are inspected by X-Ray?? Is that what the industry practices, or is sampling commonly invoked, since the processing of the board is the same for the entire PWA??

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