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September 2016

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Subject:
Re: Routing
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Mon, 19 Sep 2016 15:13:08 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Hi John - I have seen very successful laser de-paneling but there was a
limitation on board thickness. The boards needed to be more on the thin
side (0.030") than the thick side (0.100"). Plus the type of laminate
played a big role in success or failure of the process.

Dave Hillman
Rockwell Collins
[log in to unmask]

On Mon, Sep 19, 2016 at 1:36 PM, John Burke <[log in to unmask]> wrote:

> Hi guys,
>
> Discussion came up on removal of routing dust particularly under BGA's
> what is best practice?
>
> Also does anyone have experience of laser de-paneling ??
>
> Best regards,
>
> John Burke
>

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