LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

August 2016

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET August 2016

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	R: [TN] Solder under SMD Pads thickness Mins and Maxes.
From:	SALA GABRIELE <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, SALA GABRIELE <[log in to unmask]>
Date:	Mon, 29 Aug 2016 22:41:21 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (48 lines)

Hi Scott,

Both standards  IPC-A-610 F (Acceptability of Electronic Assemblies)  and
IPC/J-STD-001F  (Requirements for Soldered Electrical and Electronic
Assemblies )  for  dimension "G"  there are no specifications for  min or
max thickness, but as you have ridden  on Note 3 (some time also Note 4 for
some SMDs) for dimension "G"  they only  require :   " wetting is evident ".

That's it

Gabriele

-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Decker, Scott UTAS
Inviato: lunedì 29 agosto 2016 22:12
A: [log in to unmask]
Oggetto: [TN] Solder under SMD Pads thickness Mins and Maxes.

   For some reason, I thought I saw a spec that mentioned what the minimum
and maximum solder thicknesses are or can be between the component
termination and the board pad. I looked through the J-Standard for soldering
and could only find a reference to Dimension "G" note 3 which reads "Must
show evidence of wetting." but no minimum or maximum. Can someone point me
to the spec if there is one, for this soldering aspect of an assembly, or
tell me I'm seeing things that don't exist... Thanks in advance...
Happy Monday to all!

Scott Decker - Senior Analyst, Drafting & Design Services CID+ - Electronic
Systems Center UTC AEROSPACE SYSTEMS
3445 S. 5th Street, Suite 170, Phoenix, AZ 85040 U.S.A.
Tel: 602 308 5957  FAX: 602 243 2347
[log in to unmask]<mailto:[log in to unmask]>
www.utcaerospacesystems.com<http://www.utcaerospacesystems.com/>

CONFIDENTIALITY WARNING: This message may contain proprietary and/or
privileged information of UTC Aerospace Systems and its affiliated
companies. If you are not the intended recipient please 1) do not disclose,
copy, distribute or use this message or its contents, 2) advise the sender
by return e-mail, and 3) delete all copies (including all
attachments) from your computer. Your cooperation is greatly appreciated.
This Document Does Not Contain Export Controlled Technology Or Technical
Data.


---
Questa e-mail è stata controllata per individuare virus con Avast antivirus.
https://www.avast.com/antivirus

ATOM RSS1 RSS2

LISTSERV.IPC.ORG