I don't think such a min/max dimension exists directly to the solder thickness under the lead.
Usually evidence of good wetting is all that you are looking for, along with ensuring the maximum COMPONENT height is not exceeded.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Decker, Scott UTAS
Sent: Monday, August 29, 2016 3:12 PM
To: [log in to unmask]
Subject: [TN] Solder under SMD Pads thickness Mins and Maxes.

   For some reason, I thought I saw a spec that mentioned what the minimum and maximum solder thicknesses are or can be between the component termination and the board pad. I looked through the J-Standard for soldering and could only find a reference to Dimension "G" note 3 which reads "Must show evidence of wetting." but no minimum or maximum. Can someone point me to the spec if there is one, for this soldering aspect of an assembly, or tell me I'm seeing things that don't exist... Thanks in advance...
Happy Monday to all!

Scott Decker - Senior Analyst, Drafting & Design Services CID+ - Electronic Systems Center UTC AEROSPACE SYSTEMS
3445 S. 5th Street, Suite 170, Phoenix, AZ 85040 U.S.A.
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