For some reason, I thought I saw a spec that mentioned what the minimum and maximum solder thicknesses are or can be between the component termination and the board pad. I looked through the J-Standard for soldering and could only find a reference to Dimension "G" note 3 which reads "Must show evidence of wetting." but no minimum or maximum. Can someone point me to the spec if there is one, for this soldering aspect of an assembly, or tell me I'm seeing things that don't exist... Thanks in advance...
Happy Monday to all!

Scott Decker - Senior Analyst, Drafting & Design Services CID+ - Electronic Systems Center
UTC AEROSPACE SYSTEMS
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