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August 2016

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Fri, 19 Aug 2016 20:05:28 -0700
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If you machine into the weave you clearly have a potential for moisture ingress???

Did you consider a jig and machine the bosses?

Best regards,

John Burke
 

> On Aug 19, 2016, at 3:59 PM, Decker, Scott UTAS <[log in to unmask]> wrote:
> 
> Hi all,
>  Has anyone essentially machined down the area under mounting holes/feet of connector bosses, to control the height of the connectors? If so has it worked out OK, or were there any environmental issues with class 3 Hi Rel applications? The reason is this, we have housings that have been designed for specific board thicknesses and now due to an internal requirement, we need to make the boards about .010" thicker. This would allow us to keep the same housings and just change the mounting arrangements for the connectors. Anyone have any pros and cons to doing this type of operation?
> I've milled edges to allow thicker boards to work in card guides and such, but this one would be a new one... Thanks in advance for any input.
> 
> Scott Decker - Senior Analyst, Drafting & Design Services CID+ - Electronic Systems Center
> UTC AEROSPACE SYSTEMS
> 3445 S. 5th Street, Suite 170, Phoenix, AZ 85040 U.S.A.
> Tel: 602 308 5957  FAX: 602 243 2347
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> 
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