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From:
"Decker, Scott UTAS" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Decker, Scott UTAS
Date:
Fri, 19 Aug 2016 22:59:50 +0000
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Hi all,
  Has anyone essentially machined down the area under mounting holes/feet of connector bosses, to control the height of the connectors? If so has it worked out OK, or were there any environmental issues with class 3 Hi Rel applications? The reason is this, we have housings that have been designed for specific board thicknesses and now due to an internal requirement, we need to make the boards about .010" thicker. This would allow us to keep the same housings and just change the mounting arrangements for the connectors. Anyone have any pros and cons to doing this type of operation?
I've milled edges to allow thicker boards to work in card guides and such, but this one would be a new one... Thanks in advance for any input.

Scott Decker - Senior Analyst, Drafting & Design Services CID+ - Electronic Systems Center
UTC AEROSPACE SYSTEMS
3445 S. 5th Street, Suite 170, Phoenix, AZ 85040 U.S.A.
Tel: 602 308 5957  FAX: 602 243 2347
[log in to unmask]<mailto:[log in to unmask]>   www.utcaerospacesystems.com<http://www.utcaerospacesystems.com/>

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