residual stress. design and MFG issues. you should have co-
planarity in dwg and spell out user condition before and after reflow
simulation as part requirement. and go through qualification process
before hit production... a vendor selection problem.
On Jul 6, 2016, at 2:39 AM, Deng RongJun wrote:
> Hello fellow Techies,
> I have got a problem with shielding cans deformation issue. There
> are several kinds of shielding cans on board, we have found one
> shielding have deformation after reflow, one side of shielding lift
> and not solder on board.
> We also do a test, bake the individual shielding in oven with 230
> degree, the shielding still have deformation and two corner have
> lift. Take out the shielding from oven and temperature go down,
> then shielding go back to good.
> Any one of you have experience on this case?
> Thank you very much.
> Best regards