My instinct is to say yes. It is a concern. You should be able to rinse the
lead from the pads by double tinning with the Sn95 solder. If this is a
critical application you should confirm that the rinse works. ESD or XRF
would be useful.
On Tue, Jul 12, 2016 at 8:27 AM, Mary Grace Keenan <
[log in to unmask]> wrote:
> I have a question regarding using the high temp solder after removing
> standard solder Sn63/Pb37. After wicking away the standard solder, we need
> to re-solder the wiring and components using the high temp solder
> (Sn95/Ag5). We are concerned that the integrity of the solder joint and
> the temperature rating may be negatively affected. Is this a legitimate
> concern? Any suggestions?