Unless the solder balls are encapsulated with flux, soldermask or conformal
coat or soldered to copper they will come lose.
Had a problem with little solder balls, less than 1/2 the spacing on the
Ran on vibration test (Belgian block profile) and thermal profiles, some
always came lose.
Additional testing showed that there were no adverse consequences if left
in place due to location of product and spacing of circuit pattern, power
First time I had left them in place.
Depends on your product, consequences of failure, end item environment
On Thu, Jul 7, 2016 at 2:21 PM, Herminia Guevarra <[log in to unmask]> wrote:
> Can anybody please advise if there is IPC test method to determine if
> solder balls will become dislodged in the normal service environment?
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