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July 2016

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Subject:
From:
Herminia Guevarra <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Herminia Guevarra <[log in to unmask]>
Date:
Thu, 7 Jul 2016 19:21:54 +0000
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Hello,

Can anybody please advise if there is IPC test method to determine if solder balls will become dislodged in the normal service environment?

Thanks,
Herminia
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