Hi John - are we talking about thermal cycling of assemblies for solder
joint/design integrity or thermal cycling of boards for laminate integrity?
The IPC-9701 specification covers the thermal cycling of assemblies and is
commonly used.

Dave Hillman
Rockwell Collins
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On Thu, Jun 23, 2016 at 11:13 AM, John Burke <[log in to unmask]> wrote:

> Good morning !!
>
>
>
> A question came up on reliability testing.
>
>
>
> Typically PCBA's are thermally cycled as a part of reliability testing
> usually for 1000 cycles.
>
>
>
> What is the group's experience for non-military thermal cycling ranges?.
>
>
>
> I am often asked to use 0 - 100c sometimes -40 to 85c and sometimes various
> other thermal cycles picked from the JEDEC standard.
>
>
>
> What is the groups experience for this?. I am trying to establish "normal"
> practice.
>
>
>
> Best regards,
>
>
>
> John
>
>
>
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