Thank-you David, Noted your inputs on surface mount Simulation test and we will repeat the solderability test using this version.
Regards,Mumtaz
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
Sent: Wednesday, June 22, 2016 5:41 AM
To: [log in to unmask]
Subject: Re: [TN] laminate package wetting issues on ENIG surface
Hello Mumtaz - I recommend doing the JSTD-002 Surface Mount Simulation Test (Test S) as the QFN is a SMT component and the testing will provide a better representative assessment of your production soldering interactions.
Testing SMT components using PTH techniques is valid but the soldering dynamics can play a role in causing "false negatives" depending on a couple of solidification factors. That is the reason the JSTD-002 committee added surface mount testing options for SMT component technologies.
Dave Hillman
Rockwell Collins
[log in to unmask]
On Tue, Jun 21, 2016 at 6:42 PM, Mumtaz Bora <[log in to unmask]> wrote:
> Hello Technet team,
>
> We have a laminate based QFN package with ENIG plating on terminations.
> Using lead based paste Sn63/Pb37, we fail solderability test per
> JESD22B102E (dip and Look test) and also per J-STD-002 method B (dip
> and Look test). However, we passed reflow solderability test using
> lead free paste (SAC 305) per method JESD22B102E . Due to product
> requirements, we have to use eutectic Sn63/Pb37 solder paste. The
> reflow oven is convection air . If anyone had this issue and can share
> some insight or inputs will be much appreciated.
>
>
> Thank-you,
> Mumtaz
> 858-795-0112
>
> CONFIDENTIALITY NOTE: The information transmitted, including
> attachments, is intended only for the person(s) or entity to which it
> is addressed and may contain confidential and/or privileged material.
> Any review, retransmission, dissemination or other use of, or taking
> of any action in reliance upon this information by persons or entities
> other than the intended recipient is prohibited. If you received this
> in error, please contact the sender and destroy any copies of this information.
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or
> [log in to unmask]
> ______________________________________________________________________
>
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________
CONFIDENTIALITY NOTE: The information transmitted, including attachments, is intended only for the person(s) or entity to which it is addressed and may contain confidential and/or privileged material. Any review, retransmission, dissemination or other use of, or taking of any action in reliance upon this information by persons or entities other than the intended recipient is prohibited. If you received this in error, please contact the sender and destroy any copies of this information.
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
