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June 2016

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Subject:
From:
Mumtaz Bora <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
Date:
Wed, 22 Jun 2016 00:08:05 +0000
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Hello Joyce, The eutectic paste has ROLO flux per the data sheet. I am verifying the flux for the lead free paste.

-----Original Message-----
From: Yuan-chia Joyce Koo [mailto:[log in to unmask]]
Sent: Tuesday, June 21, 2016 4:56 PM
To: TechNet E-Mail Forum; Mumtaz Bora
Subject: Re: [TN] laminate package wetting issues on ENIG surface

what is the flux in your 63/37?  what is the flux of 305?
On Jun 21, 2016, at 7:42 PM, Mumtaz Bora wrote:

> Hello Technet team,
>
> We have a laminate based QFN package with ENIG plating on
> terminations.   Using lead based paste Sn63/Pb37,  we fail
> solderability test per JESD22B102E (dip and Look test) and also per
> J-STD-002 method B (dip and Look test). However,  we passed reflow
> solderability test using  lead free paste (SAC 305) per method
> JESD22B102E . Due to product requirements, we have to use eutectic
> Sn63/Pb37 solder paste.  The reflow oven is convection air . If
> anyone had this issue and can share some insight or inputs will be
> much appreciated.
>
>
>   Thank-you,
>   Mumtaz
> 858-795-0112
>
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