what is the flux in your 63/37?  what is the flux of 305?
On Jun 21, 2016, at 7:42 PM, Mumtaz Bora wrote:

> Hello Technet team,
>
> We have a laminate based QFN package with ENIG plating on  
> terminations.   Using lead based paste Sn63/Pb37,  we fail  
> solderability test per JESD22B102E (dip and Look test) and also per  
> J-STD-002 method B (dip and Look test). However,  we passed reflow  
> solderability test using  lead free paste (SAC 305) per method  
> JESD22B102E . Due to product requirements, we have to use eutectic  
> Sn63/Pb37 solder paste.  The reflow oven is convection air . If  
> anyone had this issue and can share some insight or inputs will be   
> much appreciated.
>
>
>   Thank-you,
>   Mumtaz
> 858-795-0112
>
> CONFIDENTIALITY NOTE: The information transmitted, including  
> attachments, is intended only for the person(s) or entity to which  
> it is addressed and may contain confidential and/or privileged  
> material. Any review, retransmission, dissemination or other use  
> of, or taking of any action in reliance upon this information by  
> persons or entities other than the intended recipient is  
> prohibited. If you received this in error, please contact the  
> sender and destroy any copies of this information.
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud  
> service.
> For more information please contact helpdesk at x2960 or  
> [log in to unmask]
> ______________________________________________________________________


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________