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June 2016

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Subject:
From:
SALA GABRIELE <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, SALA GABRIELE <[log in to unmask]>
Date:
Fri, 17 Jun 2016 14:25:48 +0200
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text/plain
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text/plain (89 lines)
Hi Victor,

The Standard  IPC/J-STD-005 "Requirements for Solder Pastes"    tells you a
lot  of details about solder paste.

Gabriele


-----Messaggio originale-----
Da: SALA GABRIELE [mailto:[log in to unmask]] 
Inviato: venerdì 17 giugno 2016 14:24
A: 'TechNet E-Mail Forum'; [log in to unmask]
Oggetto: R: [TN] Solder fines

Hi Greg,

The Standard  IPCJ-STD-005 "Requirements for Solder Pastes    tells you a
lot  of details about solder paste.

Gabriele


-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Victor Hernandez
Inviato: venerdì 17 giugno 2016 14:17
A: [log in to unmask]
Oggetto: Re: [TN] Solder fines

Greg,

   Thank you very much for sharing.   I was interested in the ball/sphere
size.   Do you know if there is a ball/sphere chart for the different solder
types.   I will also reach out to Kris Roberson at IPC.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Greg Munie
Sent: Thursday, June 16, 2016 2:49 PM
To: [log in to unmask]
Subject: Re: [TN] Solder fines

Do you mean defined solder particles as opposed to the loose solder debris
that might accompany them?

Type 6 is the smallest generally commercial powder. But there has been talk
about smaller. (From my experience at Kester MANY years ago 6 was hard
enough.)

And little non-spherical pieces do tend to infest any powder of any standard
size.

I think Kris Roberson is currently IPC liaison for the committee that
specifies size and particle distribution.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, June 16, 2016 1:19 PM
To: Technet
Subject: [TN] Solder fines

Fellow TechNetters:

What is the smallest solder fines that is currently being used in today LF
processes?.

Victor,


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