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June 2016

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 17 Jun 2016 12:17:23 +0000
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Greg,

   Thank you very much for sharing.   I was interested in the ball/sphere size.   Do you know if there is a ball/sphere chart for the different solder types.   I will also reach out to Kris Roberson at IPC.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Greg Munie
Sent: Thursday, June 16, 2016 2:49 PM
To: [log in to unmask]
Subject: Re: [TN] Solder fines

Do you mean defined solder particles as opposed to the loose solder debris that might accompany them?

Type 6 is the smallest generally commercial powder. But there has been talk about smaller. (From my experience at Kester MANY years ago 6 was hard enough.)

And little non-spherical pieces do tend to infest any powder of any standard size.

I think Kris Roberson is currently IPC liaison for the committee that specifies size and particle distribution.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, June 16, 2016 1:19 PM
To: Technet
Subject: [TN] Solder fines

Fellow TechNetters:

What is the smallest solder fines that is currently being used in today LF processes?.

Victor,


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