Do you mean defined solder particles as opposed to the loose solder debris that might accompany them?

Type 6 is the smallest generally commercial powder. But there has been talk about smaller. (From my experience at Kester MANY years ago 6 was hard enough.)

And little non-spherical pieces do tend to infest any powder of any standard size. 

I think Kris Roberson is currently IPC liaison for the committee that specifies size and particle distribution. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, June 16, 2016 1:19 PM
To: Technet <[log in to unmask]>
Subject: [TN] Solder fines

Fellow TechNetters:

   What is the smallest solder fines that is currently being used in today LF processes?.

Victor,


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