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June 2016

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Subject:
Re: Solder fines
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 16 Jun 2016 18:35:03 +0000
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Type 6 powder in a custom mix is used for some processes, and nanoparticle powder is mixed and bubble-jet printed for other applications. Those are the smallest that I am aware of.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, June 16, 2016 1:19 PM
To: [log in to unmask]
Subject: [TN] Solder fines

Fellow TechNetters:

   What is the smallest solder fines that is currently being used in today LF processes?.

Victor,


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