he should find a better vendor with application engineer that would
guide him through the process development. he also should sign nda
with the vendor and disclose the application environment requirements
of the product and subsequent MFG process, to find out any
compatibility issues, e.g. some of the conductive epoxy swelling upon
expose to humidity. if he is intended to use at low strength joints,
without flex, it is ok. conductive epoxy has less mechanical
strength compare to the solder, and it is less forgiving to any
mechanical movement (including thermal mismatch). The interface
between the conductive epoxy and what ever he try to bond also are
critical. As for the sloppy application method, the good vendor
application engineer will tell you what is the best method to apply.
some of the product designed for dispensing, some are pad printing,
etc. they are not the same. As for prototype, anything goes, you do
what ever you can lay your hands on... but function only at room
temp, you need to do a good material/process development after you
prove the concept. most likely, you will change the material to
"equivalent or better" for production with what ever the MFG
equipment in your production line or set up a platform for future...
you really can't skip a step....(doesn't look like he already has a
conductive epoxy interconnect platform established). my 1.4 cents.
jk
On Jun 13, 2016, at 6:02 PM, Nowland, Russell (Nokia - US) wrote:
> Thanks Doug,
>
> He is in an auto manufacturing OEM company now and he is trying to
> learn a new product type. In telecom we don’t use conductive epoxy
> so I have never attempted to look into it. The photo he sent me
> looks sloppy to me. They are using needle transfer and they may
> have a viscosity issue so they are getting what appears to be
> stringing. I appreciate your comments. Thank you,
>
> RUSSELL NOWLAND
> Nokia - (US)
> REPAIR STRATEGY & SUPPLIER MANAGEMENT
> Virtual Office Oklahoma
> T: +1 972 477 8665
> M: +1 405 203 0034
> [log in to unmask]<mailto:[log in to unmask]>
>
> From: David Hillman [mailto:[log in to unmask]]
> Sent: Monday, June 13, 2016 1:44 PM
> To: TechNet E-Mail Forum; Nowland, Russell (Nokia - US)
> Subject: Re: [TN] Conductive Epoxy Endpoint Requirements
>
> Hi Russell - I don't know of an industry specification (like IPC
> JSTD 001) that covers a conductive epoxy joint. We always put the
> required criteria on our drawings and do not reference any
> specification.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]<mailto:david.hillman@rockwellcollins
> .com>
>
> On Mon, Jun 13, 2016 at 1:30 PM, Russell Nowland
> <[log in to unmask]<mailto:[log in to unmask]>> wrote:
> Hey all,
>
> I was asked a question which is not something I have not dealt
> with. But being a nice guy I told them I would post a message on
> the TechNet and see if any of you have dealt with this. My friend
> is building flex circuits using conductive epoxy instead of
> solder. He was asking me what the endpoint requirements were for
> conductive epoxy because he could not find anything in IPC-610F. I
> did find IPC-3406 but that does not have conductive epoxy endpoint
> type requirements. I am not sure what to call the joints other
> than fillets but he is looking for that type of info. If you know
> what or where the industry standard for conductive epoxy available
> I would appreciate you letting me know so I can pass it on. Thank
> you,
>
>
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