Thanks John,
Interesting idea!
On the other hand, I guess there nothing like an internal qual to determine the reliability of the joints.
Best regards,
Ioan
-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de John Burke
Envoyé : Thursday, June 30, 2016 10:47 AM
À : [log in to unmask]
Objet : Re: [TN] ACF bonding
Personally, for a high reliability application with high mechanical vibration I would not use ACF.
As for the attachment methods for trials try this link:
US6776859 (B1) - Anisotropic bonding system and method using dynamic feedback
https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040817&DB=&locale=en_EP&CC=US&NR=6776859B1&KC=B1&ND=4
Best regards,
John
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Yuan-chia Joyce Koo
Sent: Thursday, June 30, 2016 4:25 AM
To: [log in to unmask]
Subject: Re: [TN] ACF bonding
it depends on product and application method (how good is the your
attachment), plus the moisture level and temp range of your product.
some of the ACF swell when expose to the high RH, you will get high resistance joint (you need to take consideration in your system design if intend used in un-controlled environment).
my 1.4 cents
jk
On Jun 29, 2016, at 4:03 PM, Ioan Tempea wrote:
> Dear Technos,
>
> Any of you have experience with ACF bonding in high reliability
> products? The application would be bonding flex to rigid PCB.
>
> A typical material datasheet is http://multimedia.3m.com/mws/media/
> 407590O/3mtm-anisotropic-conductive-film-5363.pdf
>
> Thanks,
>
> Ioan Tempea, P. Eng.
> Manufacturing Engineer, Satellite Systems
>
> [cid:[log in to unmask]]
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