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June 2016

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From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Thu, 30 Jun 2016 11:32:22 +0000
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Hi John,

The initial design is supposed to be a rigid-flex, but, due to various disappointing design constraints, we would also like to have a plan B.

So, are there any resources dealing with ACF in terms of vibration and thermal cycling?
What would be the process best practices?
What about DfA rules?

Thanks,

Ioan

De : John Burke [mailto:[log in to unmask]]
Envoyé : Wednesday, June 29, 2016 4:06 PM
À : TechNet E-Mail Forum; Ioan Tempea
Objet : Re: [TN] ACF bonding

I have extensive experience of ACF and have a patent on an assembly method but why not use a flex rigid??
Best regards,

John Burke


On Jun 29, 2016, at 1:03 PM, Ioan Tempea <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Dear Technos,

Any of you have experience with ACF bonding in high reliability products? The application would be bonding flex to rigid PCB.

A typical material datasheet is http://multimedia.3m.com/mws/media/407590O/3mtm-anisotropic-conductive-film-5363.pdf

Thanks,

Ioan Tempea, P. Eng.
Manufacturing Engineer, Satellite Systems

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