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June 2016

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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Mon, 27 Jun 2016 11:00:25 -0400
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"mud crack"? http://iweb.tms.org/PbF/JOM-0606-75.pdf

On Jun 27, 2016, at 10:03 AM, Mumtaz Bora wrote:

> Dear TechNetters,
>
> We were observing some solderability issues in laminate based QFNs.  
> The solderable terminations were plated with ENIG( Electroless  
> Nickel, Immersion Gold). SEM/EDX analysis showed Nickel plating  
> cracks on the terminations. I have requested Steve Gregory to post  
> the image on his website. If the experts can shed some light on the  
> failure mechanism, I will appreciate it.
>
>   Thank-you,
>   Mumtaz
> 858-795-0112
>
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