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Date: | Mon, 27 Jun 2016 11:00:25 -0400 |
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"mud crack"? http://iweb.tms.org/PbF/JOM-0606-75.pdf
On Jun 27, 2016, at 10:03 AM, Mumtaz Bora wrote:
> Dear TechNetters,
>
> We were observing some solderability issues in laminate based QFNs.
> The solderable terminations were plated with ENIG( Electroless
> Nickel, Immersion Gold). SEM/EDX analysis showed Nickel plating
> cracks on the terminations. I have requested Steve Gregory to post
> the image on his website. If the experts can shed some light on the
> failure mechanism, I will appreciate it.
>
> Thank-you,
> Mumtaz
> 858-795-0112
>
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