Dear TechNetters,

We were observing some solderability issues in laminate based QFNs. The solderable terminations were plated with ENIG( Electroless Nickel, Immersion Gold). SEM/EDX analysis showed Nickel plating cracks on the terminations. I have requested Steve Gregory to post the image on his website. If the experts can shed some light on the failure mechanism, I will appreciate it.

  Thank-you,
  Mumtaz
858-795-0112

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