Agree that ....-55 to +125 C was a normal (to stress solder joints)...was a normal

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Yuan-chia Joyce Koo
Sent: Friday, 24 June 2016 3:02 AM
To: [log in to unmask]
Subject: Re: [TN] Thermal Cycle Testing

ATT years ago got paper talk about different environment and  test schedule (Acceleration  factor).  office environment, equipment up/ 
down time (e.g. 8 hour on, 16 hour off), out door, uncontrolled,etc.   
normally, I dealt with old days -55 to +125 C for most of the high rel equipment.  -10 to +90 for commercial usage (office environment)... TC 1000 cycle minimum without failure for high rel product, and 3000 cycle for info (define possible end  of life failure mode and provide design risk mitigation), 500 cycle with minimum drift of key parameters for commercial product - depend upon the service life... 1000 cycle for info and parameter should still within a design limit - unless you have active adjustment within the design to compensate  the drift. etc. etc.  my 1.4 cents.
   jk

On Jun 23, 2016, at 2:29 PM, John Burke wrote:

> For completed assemblies which may or may not be cased.
>
> Reason for the question is as stated that we have many differing 
> requirements normally from customers which vary widely even though the 
> target equipment is the same....8-(
>
> The test we actually carry out internally are fairly extreme given the 
> typically benighn environment into which they are put.
>
> Just wanted a quick straw poll on others test parameters
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
> Sent: Thursday, June 23, 2016 9:31 AM
> To: [log in to unmask]
> Subject: Re: [TN] Thermal Cycle Testing
>
> Hi John - are we talking about thermal cycling of assemblies for 
> solder joint/design integrity or thermal cycling of boards for 
> laminate integrity?
> The IPC-9701 specification covers the thermal cycling of assemblies 
> and is commonly used.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
> On Thu, Jun 23, 2016 at 11:13 AM, John Burke <[log in to unmask]> wrote:
>
>> Good morning !!
>>
>>
>>
>> A question came up on reliability testing.
>>
>>
>>
>> Typically PCBA's are thermally cycled as a part of reliability 
>> testing usually for 1000 cycles.
>>
>>
>>
>> What is the group's experience for non-military thermal cycling 
>> ranges?.
>>
>>
>>
>> I am often asked to use 0 - 100c sometimes -40 to 85c and sometimes 
>> various other thermal cycles picked from the JEDEC standard.
>>
>>
>>
>> What is the groups experience for this?. I am trying to establish 
>> "normal"
>> practice.
>>
>>
>>
>> Best regards,
>>
>>
>>
>> John
>>
>>
>>
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