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Hi Greg,
The Standard IPCJ-STD-005 "Requirements for Solder Pastes tells you a
lot of details about solder paste.
Gabriele
-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Victor Hernandez
Inviato: venerdì 17 giugno 2016 14:17
A: [log in to unmask]
Oggetto: Re: [TN] Solder fines
Greg,
Thank you very much for sharing. I was interested in the ball/sphere
size. Do you know if there is a ball/sphere chart for the different solder
types. I will also reach out to Kris Roberson at IPC.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Greg Munie
Sent: Thursday, June 16, 2016 2:49 PM
To: [log in to unmask]
Subject: Re: [TN] Solder fines
Do you mean defined solder particles as opposed to the loose solder debris
that might accompany them?
Type 6 is the smallest generally commercial powder. But there has been talk
about smaller. (From my experience at Kester MANY years ago 6 was hard
enough.)
And little non-spherical pieces do tend to infest any powder of any standard
size.
I think Kris Roberson is currently IPC liaison for the committee that
specifies size and particle distribution.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, June 16, 2016 1:19 PM
To: Technet
Subject: [TN] Solder fines
Fellow TechNetters:
What is the smallest solder fines that is currently being used in today LF
processes?.
Victor,
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