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Date: | Tue, 21 Jun 2016 23:42:26 +0000 |
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Hello Technet team,
We have a laminate based QFN package with ENIG plating on terminations. Using lead based paste Sn63/Pb37, we fail solderability test per JESD22B102E (dip and Look test) and also per J-STD-002 method B (dip and Look test). However, we passed reflow solderability test using lead free paste (SAC 305) per method JESD22B102E . Due to product requirements, we have to use eutectic Sn63/Pb37 solder paste. The reflow oven is convection air . If anyone had this issue and can share some insight or inputs will be much appreciated.
Thank-you,
Mumtaz
858-795-0112
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