In looking at the test methods for a proprietary semi-solder paste/solder ink, I wanted to test slumping. The material I am qualifying is actually a blend. I have the small staggered stencil, but  J-STD-005  says:


3.7 Solder Ball Test; the solder paste when tested in accordance with 3.7.1 shall meet the requirements specified.

3.7.1 Type 1-6 Powder; the solder paste with Type 1 through 4 type powders defined in IPC-TM-650, Test Method 2.4.43, shall meet the acceptance criteria presented in Figure 3-3.

3.7.2 Type 7 Powder; the solder paste with type 7 powders does not require testing and should be determined AABUS.

So how do I test a Type 5 or 6? Is Method 2.4.43 applicable?

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