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May 2016

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
Date:
Wed, 4 May 2016 09:34:03 -0400
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text/plain
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On 5/4/2016 9:14 AM, Stadem, Richard D. wrote:
> In looking at the test methods for a proprietary semi-solder paste/solder ink, I wanted to test slumping. The material I am qualifying is actually a blend. I have the small staggered stencil, but  J-STD-005  says:
>
>
> 3.7 Solder Ball Test; the solder paste when tested in accordance with 3.7.1 shall meet the requirements specified.
>
> 3.7.1 Type 1-6 Powder; the solder paste with Type 1 through 4 type powders defined in IPC-TM-650, Test Method 2.4.43, shall meet the acceptance criteria presented in Figure 3-3.
>
> 3.7.2 Type 7 Powder; the solder paste with type 7 powders does not require testing and should be determined AABUS.
>
> So how do I test a Type 5 or 6? Is Method 2.4.43 applicable?
>
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yes, the test is applicable to types 1, 2, 3, 4, 5 and 6.


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