Minor Qualification:
Change in process that yields the same or better product
  Stencil Change
  Pick and Place Change
  Reflow oven change stays in parameters of material
  Move equipment across room
  Replace with equivalent equipment
  Component change same for same (R and C values, same class discrete and
actives)

Qualification:
Verified by measurement, X-ray,cross section, yield data, other process
measurements routinely used for product
Pocess and functional MDA testing
Enough data to be statistically relevant, T test, Mini tab 6 pack
statistical tools

Major Change
Change in process that makes product different
   Solder Paste; Change lead to lead free, change in flux clean to no
clean, change in flux
   Reflow process out side of recommended parameters
   New process introduced to facility
   New Material introduced into facility
   Prior example that changes thermal interface of solder joints
   Change in component class, in particular down rated (non automotive used
for automotive application)

Qualification:
   Same as Minor Change
   In addition:
   Testing required for changes by contract;
      strain gauge testing
      Revalent PPAP tests (Some legs could be skipped depending on change,
same decision as new product testing)
          PPAP testing includes thermal shock, salt spray, spilled liquids,
humidity, other tests specific to product
      If non ustomotive, testing that verify product design changes, varies
by industruy

Too many problems occur when a new process is introduced into a facility.
Examples of the little things, the 3M tape for soldemask adhesion has
different properties of the same number depending on what supply chain is
used (discussed in previous post). It is very easy to have shake out
problems on the new process even when transferred from another location.
Other process materials may be sourced from different supplier sites. not
all are 100% the same.


Larry Dzaugis
Manufacturing Engineer


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