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Subject:
From:
Ed Popielarski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ed Popielarski <[log in to unmask]>
Date:
Tue, 24 May 2016 17:34:55 +0000
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Ed Popielarski
Engineering Manager

[cid:[log in to unmask]]
                               970 NE 21st Ct.
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From: Chris BALL [mailto:[log in to unmask]]
Sent: Tuesday, May 24, 2016 10:26 AM
To: TechNet E-Mail Forum
Cc: Steve Gregory; Ed Popielarski; [log in to unmask]; [log in to unmask]; David Hillman
Subject: Re: [TN] what is acceptable % of copper leaching in barrel and pad

Thank you VERY VERY much for your quick and on-topic, informative responses. Steve, Ed, George, John and Dave; I am in debt and in awe. Your responses were exactly what I was looking for.

By the way, I really truly composed this about a  week ago, then jumped to something and it stayed in draft until now. That's how I roll lately.

Best Regards,
Chris
-------------------------------------------------
   Chris Ball  (248)619-8430
   Valeo - Group Electronics Expertise and Development Services (GEEDS)
   150 Stephenson Highway
   Troy,MI 48083

On Tue, May 17, 2016 at 5:25 PM, David Hillman <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Hi Chris - some more info to add to the good comments you have already received. If you do a paper search, you will find that Craig Hamilton from Celestica, and Dr. Chris Hunt, NPL, both did some very good work on copper dissolution that you may find helpful. Jeff Kennedy, Ross Wilcoxon and I published copper dissolution work for SAC305 and SN100C at the SMTA ICSR conference (either 2012 or 2013) that we conducted as part of the NASA DoD Lead-free Solder Project consortia work. Figure 12 has a copper thickness versus wave solder processing time graph that might be useful. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]<mailto:[log in to unmask]>


On Mon, May 16, 2016 at 4:50 PM, Chris BALL <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Hello Gurus,

Not sure who to ask or how best to ask it, but here goes:

We've seen what appears to be a large % of the plating in hole barrel and
board surface vanish during a wave solder operation. I can find some info
about what is acceptable loss levels on component terminations but haven't
found similar for the board itself.

Need to find IPC references/recommendations for MAX copper leaching for
solder source side of lands on the board and in hole barrels.

Feeling old, tired, and thickheaded. Any help will be appreciated.

Best Regards,
Chris
-------------------------------------------------
   Chris Ball  (248)619-8430<tel:%28248%29619-8430>
   Valeo - *G*roup *E*lectronics *E*xpertise and *D*evelopment *S*ervices
(GEEDS)
   150 Stephenson Highway
   Troy,MI 48083


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