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May 2016

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Subject:
From:
Matthias Mansfeld <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Matthias Mansfeld <[log in to unmask]>
Date:
Fri, 20 May 2016 23:17:11 +0300
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On 20 May 2016 at 18:08, stephen gregory wrote:

> Hi All, Question, how common is the practice of using high current
> to clear bare PCB inner layer shorts? 

Concerning my customers and suppliers: forbidden, because the remains 
of the "fired" short (charred board material, "doped" with finespread 
copper) end up (depends on the normal operation voltages between 
these tracks) with slow "dendrite" growth and subsequent new shorts. 
In the best case the unit fails completely, in the worst case, the 
new, fine dendrite structures get blown with contact, cause a 
sporadic error (reboot or something else) and the game begins new. 
Sporadic fail every X hours (the time the blown dendrite needs to 
grow again).

Regards
Matthias Mansfeld
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Matthias Mansfeld Elektronik * Leiterplattenlayout
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