Hello Technet`s,

As we know above 6 micrometers of intermetallic (CuSn) could cause failure due to brittle structure of the intermetallic. I found in some experiment that at 100 deg C after 32 days the intermetallic (CuSn from Sn-40Pb) grow in about 6 micron. Is it true? What should I do if the board should see 100 deg C for long time and what about >=90 dig?

Thanks,

Dr. Gil Zilber
Technologiest
Elta Systems Ltd.

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