Have not wave soldered for about 4 years but seem to remember that using SN100C alloy from Aim eliminated the issue due to the nickel loading.



Best regards,

John Burke
 

> On May 16, 2016, at 2:50 PM, Chris BALL <[log in to unmask]> wrote:
> 
> Hello Gurus,
> 
> Not sure who to ask or how best to ask it, but here goes:
> 
> We've seen what appears to be a large % of the plating in hole barrel and
> board surface vanish during a wave solder operation. I can find some info
> about what is acceptable loss levels on component terminations but haven't
> found similar for the board itself.
> 
> Need to find IPC references/recommendations for MAX copper leaching for
> solder source side of lands on the board and in hole barrels.
> 
> Feeling old, tired, and thickheaded. Any help will be appreciated.
> 
> Best Regards,
> Chris
> -------------------------------------------------
>   Chris Ball  (248)619-8430
>   Valeo - *G*roup *E*lectronics *E*xpertise and *D*evelopment *S*ervices
> (GEEDS)
>   150 Stephenson Highway
>   Troy,MI 48083
> 
> 
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