Hi Chris,

There was something put out by Vitronics Soltec in 2007 that studied that.
They showed that a board would leach 24% in a single wave running at 265 C.
with a contact time of 3.7 sec., it would leach 35% in a dual wave running
at 320 C. with a contact time of 3 sec., and 9% in a selective solder
running at 290 C. with a contact time of 2.5 sec. These were OSP boards and
the solder was a SAC305.

http://www.laocsmta.org/archive/April_2007_Vitronics_Presentation.pdf


Steve

On Mon, May 16, 2016 at 3:50 PM, Chris BALL <[log in to unmask]> wrote:

> Hello Gurus,
>
> Not sure who to ask or how best to ask it, but here goes:
>
> We've seen what appears to be a large % of the plating in hole barrel and
> board surface vanish during a wave solder operation. I can find some info
> about what is acceptable loss levels on component terminations but haven't
> found similar for the board itself.
>
> Need to find IPC references/recommendations for MAX copper leaching for
> solder source side of lands on the board and in hole barrels.
>
> Feeling old, tired, and thickheaded. Any help will be appreciated.
>
> Best Regards,
> Chris
> -------------------------------------------------
>    Chris Ball  (248)619-8430
>    Valeo - *G*roup *E*lectronics *E*xpertise and *D*evelopment *S*ervices
> (GEEDS)
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>
>
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