Hello Gurus,

Not sure who to ask or how best to ask it, but here goes:

We've seen what appears to be a large % of the plating in hole barrel and
board surface vanish during a wave solder operation. I can find some info
about what is acceptable loss levels on component terminations but haven't
found similar for the board itself.

Need to find IPC references/recommendations for MAX copper leaching for
solder source side of lands on the board and in hole barrels.

Feeling old, tired, and thickheaded. Any help will be appreciated.

Best Regards,
Chris
-------------------------------------------------
   Chris Ball  (248)619-8430
   Valeo - *G*roup *E*lectronics *E*xpertise and *D*evelopment *S*ervices
(GEEDS)
   150 Stephenson Highway
   Troy,MI 48083


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________
-- 


*This e-mail message is intended only for the use of the intended recipient(s).
The information contained therein may be confidential or privileged,
and its disclosure or reproduction is strictly prohibited.
If you are not the intended recipient, please return it immediately to its sender 
at the above address and destroy it. *