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Mon, 16 May 2016 17:41:10 -0700 |
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Have not wave soldered for about 4 years but seem to remember that using SN100C alloy from Aim eliminated the issue due to the nickel loading.
Best regards,
John Burke
> On May 16, 2016, at 2:50 PM, Chris BALL <[log in to unmask]> wrote:
>
> Hello Gurus,
>
> Not sure who to ask or how best to ask it, but here goes:
>
> We've seen what appears to be a large % of the plating in hole barrel and
> board surface vanish during a wave solder operation. I can find some info
> about what is acceptable loss levels on component terminations but haven't
> found similar for the board itself.
>
> Need to find IPC references/recommendations for MAX copper leaching for
> solder source side of lands on the board and in hole barrels.
>
> Feeling old, tired, and thickheaded. Any help will be appreciated.
>
> Best Regards,
> Chris
> -------------------------------------------------
> Chris Ball (248)619-8430
> Valeo - *G*roup *E*lectronics *E*xpertise and *D*evelopment *S*ervices
> (GEEDS)
> 150 Stephenson Highway
> Troy,MI 48083
>
>
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