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Mon, 16 May 2016 16:50:55 -0500 |
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Hello Gurus,
Not sure who to ask or how best to ask it, but here goes:
We've seen what appears to be a large % of the plating in hole barrel and
board surface vanish during a wave solder operation. I can find some info
about what is acceptable loss levels on component terminations but haven't
found similar for the board itself.
Need to find IPC references/recommendations for MAX copper leaching for
solder source side of lands on the board and in hole barrels.
Feeling old, tired, and thickheaded. Any help will be appreciated.
Best Regards,
Chris
-------------------------------------------------
Chris Ball (248)619-8430
Valeo - *G*roup *E*lectronics *E*xpertise and *D*evelopment *S*ervices
(GEEDS)
150 Stephenson Highway
Troy,MI 48083
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