Hi Gil,

the Nickel layer quality is critical for the solder joints defects creation
later.

On Tue, Apr 5, 2016 at 6:08 PM, Zilber Gil <[log in to unmask]> wrote:

> Thank you,
>
> Gil
>
>
>
> נשלח ממכשיר הSamsung שלי
>
>
> -------- הודעה מקורית --------
> מאת: David Hillman <[log in to unmask]>
> תאריך: 05/04/2016 17:09 (GMT+02:00)
> אל: Zilber Gil <[log in to unmask]>
> עותק: TechNet E-Mail Forum <[log in to unmask]>
> נושא: Re: [TN] Pad construction
>
> Hi Gil - the Au layer doesn't concern me provided the nickel barrier layer
> is fabricated/plated correctly. You would be soldering to the nickel layer
> and not the gold layer.The nickel layer should not diffuse away in a
> controlled soldering process.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]<mailto:[log in to unmask]
> >
>
> On Tue, Apr 5, 2016 at 9:01 AM, Zilber Gil <[log in to unmask]<mailto:
> [log in to unmask]>> wrote:
> Hi Dave,
> Thank you the response,
> Layer 1 is probably, the Pd/Au fired metallization, but the 4 micron pure
> Au is in addition to that. Is it an issue?
>
> Thanks,
>
> Gil
>
> From: David Hillman [mailto:[log in to unmask]<mailto:
> [log in to unmask]>]
> Sent: Tuesday, April 05, 2016 4:22 PM
> To: TechNet E-Mail Forum; Zilber Gil
> Subject: Re: [TN] Pad construction
>
> Hi Gil - I am making the assumption that the Pd/Au is a fired
> metallization layer that is part of the component ceramic body fabrication
> process. The nickel is a soldering diffusion barrier to prevent the Pd/Au
> from being leached off and you have SnPb layer for solderability. Pretty
> standard type of plating stackup for a ceramic bodied component (i.e.
> precious metal layer/diffusion barrier/solderable layer). I don't see this
> plating stackup as causing you any issues. As always, ceramic body
> components can often have CTE mismatch issues which impacts the solder
> joint integrity but that is not an issue related to the plating stackup.
>
> Dave
>
> On Tue, Apr 5, 2016 at 2:29 AM, Zilber Gil <[log in to unmask]<mailto:
> [log in to unmask]>> wrote:
> Hi All,
> I have an attenuator (ceramic body) with the following pad layers:
> 1. Pd - adhesion layer
> 2. Au- 4 micrometer
> 3. Ni - 1.8 micrometer
> 4. SnPb
>
> This is the first time I am seeing such a pad construction. Does anyone
> have an idea if I should expect any reliability issue (aerospace
> application)?
>
>
> Thanks,
>
>
> Dr. Gil Zilber
> Elta Systmes Ltd.
>
>
>
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