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April 2016

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Subject:
From:
"Maguire, James F" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Maguire, James F
Date:
Mon, 18 Apr 2016 22:02:38 +0000
Content-Type:
text/plain
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text/plain (1 lines)
What is temp cycle condition again?  You have 50 to 125C but did you mean -50C to +125C?  Also are you doing temp cycle or air/air temp shock (ie. what is ramp rate in chamber or better yet as measured on the product during temp cycle).


Jim Maguire
Intel Corporation
ATD Q&R Stress Lab Operations
Hawthorne Farms; Oregon
Engineer
Phone: 503-696-3309
Cell:  253-651-9373

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ricardo Moncaglieri
Sent: Monday, April 18, 2016 2:58 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Cracking After Thermal Cicling

Steve,
Responding your question.
 
Soldered connection is not put under vibration during temp cicling.
 
This terminal belongs to a connector which is screwed on a case and its terminal passes through this metalic case and lyies on the pcb ENEPIG pad.
So that there are following CTEs playing and intercating each other all
together:
 
PCB CTE
Solder CTE
Case CTE where is screwed the conector
Terminal CTE
 
brgds,Ricardo

>>> Steve Gregory <[log in to unmask]> 18/04/2016 18:47 >>>
Hi Ricardo,

I finally have your pictures up, they are here:

http://stevezeva.homestead.com/A15_Photos_of_pre__post_100_temp_cycling_CSC-10_SN12.pdf

Boy, that looks like a big CTE mis-match. A question; are the boards going through ESS? Vibration along with the temp cycling?

Steve

On Mon, Apr 18, 2016 at 2:35 PM, Ricardo Moncaglieri < [log in to unmask]> wrote:

> Steve,
> Attached arethe pictures.
> Thank you a lot.
> Await for your comments.
> brgds,Ricardo
>
> >>> Steve Gregory <[log in to unmask]> 18/04/2016 15:22 >>>
> Hi Ricardo,
>
> The Technet server strips the attachments, send your photo directly
to me
> and I'll get it posted...
>
> Steve
>
> On Mon, Apr 18, 2016 at 11:43 AM, Ricardo Moncaglieri < 
> [log in to unmask]> wrote:
>
> > Dear colleagues;
> >
> > Steve Gregory, could you please upload the enclosed picture?
> >
> > Solder become perturbated / cracked after thermal cicling:
> >
> > This picture corresponds to a plane (not circular) conector
terminal
> > solded to a pcb pad ENEPIG finished.
> > The connector terminal has been gold removed by twice pretin.
> > Solder used is Sn63Pb37.
> > Thermal cicling: 50°C to 125°C
> >
> > As picture showed there are stretch marks toward left direction
and
> > showed solder crack.
> >
> > Our provider reported temperature didnt pass over 125°C and solder
used
> > 63/37.
> >
> > Question:
> >
> > How could these kind of gooves or stretch marks have been produced 
> > taking into account they are just toward one direction (left) and
of
> > considerable length?
> > Just mecanic stress?
> > Temperature overpassing on any cicle?
> > Need of use of different alloy, ie.: In, Bi etc?
> > Provider reported the process is being useed from them since long
ago
> > (same solder alloy, temperature, pcb, terminal conector, thermal
> > cicling) but this is the first time they faced with such a
cracking.
> >
> > Do you have any comment in order to anlyse/solve this trouble.
> >
> > Appreciate your feedback we are in middle of a providing
acceptance
> > tests space quality level (IPC class 3).
> >
> > brgds,Ricardo
> >
> >
> >
> >
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> >
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> >
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