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April 2016

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Mon, 18 Apr 2016 12:22:53 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (71 lines)
Hi Ricardo,

The Technet server strips the attachments, send your photo directly to me
and I'll get it posted...

Steve

On Mon, Apr 18, 2016 at 11:43 AM, Ricardo Moncaglieri <
[log in to unmask]> wrote:

> Dear colleagues;
>
> Steve Gregory, could you please upload the enclosed picture?
>
> Solder become perturbated / cracked after thermal cicling:
>
> This picture corresponds to a plane (not circular) conector terminal
> solded to a pcb pad ENEPIG finished.
> The connector terminal has been gold removed by twice pretin.
> Solder used is Sn63Pb37.
> Thermal cicling: 50°C to 125°C
>
> As picture showed there are stretch marks toward left direction and
> showed solder crack.
>
> Our provider reported temperature didnt pass over 125°C and solder used
> 63/37.
>
> Question:
>
> How could these kind of gooves or stretch marks have been produced
> taking into account they are just toward one direction (left) and of
> considerable length?
> Just mecanic stress?
> Temperature overpassing on any cicle?
> Need of use of different alloy, ie.: In, Bi etc?
> Provider reported the process is being useed from them since long ago
> (same solder alloy, temperature, pcb, terminal conector, thermal
> cicling) but this is the first time they faced with such a cracking.
>
> Do you have any comment in order to anlyse/solve this trouble.
>
> Appreciate your feedback we are in middle of a providing acceptance
> tests space quality level (IPC class 3).
>
> brgds,Ricardo
>
>
>
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