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Subject:
From:
Zilber Gil <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Zilber Gil <[log in to unmask]>
Date:
Tue, 5 Apr 2016 15:08:41 +0000
Content-Type:
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Thank you,

Gil



נשלח ממכשיר הSamsung שלי


-------- הודעה מקורית --------
מאת: David Hillman <[log in to unmask]>
תאריך: 05/04/2016 17:09 (GMT+02:00)
אל: Zilber Gil <[log in to unmask]>
עותק: TechNet E-Mail Forum <[log in to unmask]>
נושא: Re: [TN] Pad construction

Hi Gil - the Au layer doesn't concern me provided the nickel barrier layer is fabricated/plated correctly. You would be soldering to the nickel layer and not the gold layer.The nickel layer should not diffuse away in a controlled soldering process.

Dave Hillman
Rockwell Collins
[log in to unmask]<mailto:[log in to unmask]>

On Tue, Apr 5, 2016 at 9:01 AM, Zilber Gil <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Hi Dave,
Thank you the response,
Layer 1 is probably, the Pd/Au fired metallization, but the 4 micron pure Au is in addition to that. Is it an issue?

Thanks,

Gil

From: David Hillman [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Sent: Tuesday, April 05, 2016 4:22 PM
To: TechNet E-Mail Forum; Zilber Gil
Subject: Re: [TN] Pad construction

Hi Gil - I am making the assumption that the Pd/Au is a fired metallization layer that is part of the component ceramic body fabrication process. The nickel is a soldering diffusion barrier to prevent the Pd/Au from being leached off and you have SnPb layer for solderability. Pretty standard type of plating stackup for a ceramic bodied component (i.e. precious metal layer/diffusion barrier/solderable layer). I don't see this plating stackup as causing you any issues. As always, ceramic body components can often have CTE mismatch issues which impacts the solder joint integrity but that is not an issue related to the plating stackup.

Dave

On Tue, Apr 5, 2016 at 2:29 AM, Zilber Gil <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Hi All,
I have an attenuator (ceramic body) with the following pad layers:
1. Pd - adhesion layer
2. Au- 4 micrometer
3. Ni - 1.8 micrometer
4. SnPb

This is the first time I am seeing such a pad construction. Does anyone have an idea if I should expect any reliability issue (aerospace  application)?


Thanks,


Dr. Gil Zilber
Elta Systmes Ltd.



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The information contained in this communication is proprietary to Israel Aerospace Industries Ltd. and/or third parties, may contain confidential or privileged information, and is intended only for the use of the intended addressee thereof. If you are not the intended addressee, please be aware that any use, disclosure, distribution and/or copying of this communication is strictly prohibited. If you receive this communication in error, please notify the sender immediately and delete it from your computer.


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