Hi Gil - I am making the assumption that the Pd/Au is a fired metallization
layer that is part of the component ceramic body fabrication process. The
nickel is a soldering diffusion barrier to prevent the Pd/Au from being
leached off and you have SnPb layer for solderability. Pretty standard type
of plating stackup for a ceramic bodied component (i.e. precious metal
layer/diffusion barrier/solderable layer). I don't see this plating stackup
as causing you any issues. As always, ceramic body components can often
have CTE mismatch issues which impacts the solder joint integrity but that
is not an issue related to the plating stackup.

Dave

On Tue, Apr 5, 2016 at 2:29 AM, Zilber Gil <[log in to unmask]> wrote:

> Hi All,
> I have an attenuator (ceramic body) with the following pad layers:
> 1. Pd - adhesion layer
> 2. Au- 4 micrometer
> 3. Ni - 1.8 micrometer
> 4. SnPb
>
> This is the first time I am seeing such a pad construction. Does anyone
> have an idea if I should expect any reliability issue (aerospace
> application)?
>
>
> Thanks,
>
>
> Dr. Gil Zilber
> Elta Systmes Ltd.
>
>
>
> The information contained in this communication is proprietary to Israel
> Aerospace Industries Ltd. and/or third parties, may contain confidential or
> privileged information, and is intended only for the use of the intended
> addressee thereof. If you are not the intended addressee, please be aware
> that any use, disclosure, distribution and/or copying of this communication
> is strictly prohibited. If you receive this communication in error, please
> notify the sender immediately and delete it from your computer.
>
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________