compress stress also may induce some whiskers if specific type of  
coating  used.  In addition, compress stress may extruded the soft  
solder to the adjacent free space (if there is enough heat generated  
by the pin, e.g. thermal ground  or power).
On Apr 22, 2016, at 2:29 PM, Nutting, Phil wrote:

> Ioan,
>
> My observation has been that wires tinned and then connected via a  
> compression screw seem to suffer from "cold flow".  I can't say  
> that this was the cause of failures, but I consider it a cause for  
> concern and possibly a design improvement by using a different  
> termination method.
>
> My 2 cents.
>
> Phil
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
> Sent: Friday, April 22, 2016 1:43 PM
> To: [log in to unmask]
> Subject: [TN] Compression and solder creep
>
> Dear Technos,
>
> Keeping solder joints under constant load decreases their life. I  
> was reading through the chapter dedicated to creep in Klein- 
> Wassink, but he is not specific if the type of load has an effect  
> or simply any type of load is equally detrimental.
>
> More specifically, is compressive load a creep accelerator, or not?  
> E.g. keeping a weight on mated connectors, to prevent them from de- 
> mating in vibration, would reduce the life of the solder joints of  
> those connectors?
>
> Thanks,
>
> Ioan Tempea, P. Eng.
> Manufacturing Engineer, Satellite Systems
>
> [cid:[log in to unmask]]
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