what is the tg of the board?  CTE?  only 100 C cycle - something  
wrong with your design.
On Apr 18, 2016, at 6:05 PM, Ricardo Moncaglieri wrote:

> Jim,
> Temp cycle range is +50°C to +125°C.
> I dont have yet the temp ramp rate.
> brgds,Ricardo
>
>>>> "Maguire, James F" <[log in to unmask]> 18/04/2016 19:02
>>>>
> What is temp cycle condition again?  You have 50 to 125C but did you
> mean -50C to +125C?  Also are you doing temp cycle or air/air temp  
> shock
> (ie. what is ramp rate in chamber or better yet as measured on the
> product during temp cycle).
>
>
> Jim Maguire
> Intel Corporation
> ATD Q&R Stress Lab Operations
> Hawthorne Farms; Oregon
> Engineer
> Phone: 503-696-3309
> Cell:  253-651-9373
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ricardo
> Moncaglieri
> Sent: Monday, April 18, 2016 2:58 PM
> To: [log in to unmask]
> Subject: Re: [TN] Solder Cracking After Thermal Cicling
>
> Steve,
> Responding your question.
>
> Soldered connection is not put under vibration during temp cicling.
>
> This terminal belongs to a connector which is screwed on a case and  
> its
> terminal passes through this metalic case and lyies on the pcb ENEPIG
> pad.
> So that there are following CTEs playing and intercating each other
> all
> together:
>
> PCB CTE
> Solder CTE
> Case CTE where is screwed the conector
> Terminal CTE
>
> brgds,Ricardo
>
>>>> Steve Gregory <[log in to unmask]> 18/04/2016 18:47 >>>
> Hi Ricardo,
>
> I finally have your pictures up, they are here:
>
> http://stevezeva.homestead.com/ 
> A15_Photos_of_pre__post_100_temp_cycling_CSC-10_SN12.pdf
>
> Boy, that looks like a big CTE mis-match. A question; are the boards
> going through ESS? Vibration along with the temp cycling?
>
> Steve
>
> On Mon, Apr 18, 2016 at 2:35 PM, Ricardo Moncaglieri <
> [log in to unmask]> wrote:
>
>> Steve,
>> Attached arethe pictures.
>> Thank you a lot.
>> Await for your comments.
>> brgds,Ricardo
>>
>>>>> Steve Gregory <[log in to unmask]> 18/04/2016 15:22 >>>
>> Hi Ricardo,
>>
>> The Technet server strips the attachments, send your photo directly
> to me
>> and I'll get it posted...
>>
>> Steve
>>
>> On Mon, Apr 18, 2016 at 11:43 AM, Ricardo Moncaglieri <
>> [log in to unmask]> wrote:
>>
>>> Dear colleagues;
>>>
>>> Steve Gregory, could you please upload the enclosed picture?
>>>
>>> Solder become perturbated / cracked after thermal cicling:
>>>
>>> This picture corresponds to a plane (not circular) conector
> terminal
>>> solded to a pcb pad ENEPIG finished.
>>> The connector terminal has been gold removed by twice pretin.
>>> Solder used is Sn63Pb37.
>>> Thermal cicling: 50°C to 125°C
>>>
>>> As picture showed there are stretch marks toward left direction
> and
>>> showed solder crack.
>>>
>>> Our provider reported temperature didnt pass over 125°C and solder
> used
>>> 63/37.
>>>
>>> Question:
>>>
>>> How could these kind of gooves or stretch marks have been produced
>
>>> taking into account they are just toward one direction (left) and
> of
>>> considerable length?
>>> Just mecanic stress?
>>> Temperature overpassing on any cicle?
>>> Need of use of different alloy, ie.: In, Bi etc?
>>> Provider reported the process is being useed from them since long
> ago
>>> (same solder alloy, temperature, pcb, terminal conector, thermal
>>> cicling) but this is the first time they faced with such a
> cracking.
>>>
>>> Do you have any comment in order to anlyse/solve this trouble.
>>>
>>> Appreciate your feedback we are in middle of a providing
> acceptance
>>> tests space quality level (IPC class 3).
>>>
>>> brgds,Ricardo
>>>
>>>
>>>
>>>
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