yes. photo-DSC will tell you. It all depend upon the formulation of
the material - exotherm and response to the lamp (wavelength
distribution plus thermal generated heat). You might get shrinkage
if excessive UV is used. If you use embedded components in the
board, shrinkage stress might cause component value drifting...
another story. Nobody publish that kind of stuff (I don't think.
But I am out of the field for a while now).
jk
On Apr 7, 2016, at 3:59 PM, Brian Stumm wrote:
> I'd like to expand upon what Doug said because I know his company
> has done
> studies related to this... I'm not sure if that data is available
> publically or not.
>
> I manufacture UV and Thermal cure ovens as well as SMT Reflow ovens.
>
> It is common practice to attach thermocouples to PCB Assemblies and
> record
> thermal profiles for use in verifying the reflow process. Data such
> as rise
> rate and peak temperature are recorded.
>
> How many of you have conducted thermal profiling in your UV curing
> process?
> You would be amazed to see the rise rates, which far exceed the
> limits of
> SMT reflow soldering.
>
> YMMV,
>
> Brian
>
>
> On Thu, Apr 7, 2016 at 12:23 PM, Douglas Pauls <
> [log in to unmask]> wrote:
>
>> Good afternoon Rich,
>>
>> As Joyce and Steve have pointed out, components like UV PROMs or
>> UV EPROMs
>> are susceptible, but that is easily fixed with a black tape over the
>> programming window.
>>
>> In general, you should not get much damage as the UV tracer dye
>> that is in
>> most coatings will absorb some of the incoming UV energy.
>>
>> Corey Peterson, Rockwell Automation, wrote an excellent paper on
>> optimizing
>> the UV cure process. ULTRAVIOLET CONFORMAL COATING PROCESS
>> DEVELOPMENT.
>>
>> He found that some of the plastic sleeving on tall caps were damaged
>> because the tops were much closer to the UV lamp.
>>
>> *"The damaged sleeving on this capacitor body shown in Figure 9
>> was not the
>> result from thermal excess. A thermal profile was taken and
>> indicated that
>> the temperature at the top of the capacitor was only 86ºC. This
>> temperature
>> is lower than would be expected in normal wave soldering
>> processes. The
>> source of damage for this capacitor is from the UV energy itself.
>> This
>> damage could have two mechanisms. The tearing of the sleeving is
>> right
>> where component identification was stamped into the sleeving and
>> could have
>> produced a weak spot in the sleeving. The other possible mechanism
>> is the
>> component color itself. Sleeve tearing on Black, Dark Blue, and
>> Brown parts
>> could not be duplicated."*
>>
>> Lots of great info in that paper. I can send you a copy if you wish.
>>
>>
>> Doug Pauls
>> Principal Materials and Process Engineer
>> Rockwell Collins
>>
>> On Thu, Apr 7, 2016 at 1:59 PM, Richard Kraszewski <
>> [log in to unmask]> wrote:
>>
>>> Have a customer who is very concerned that the cure UV light from
>>> conformal coating cure process might be harmful to their(any)
>>> electronic
>>> assembly.
>>>
>>> Historically we have UV cured automotive and industrial
>>> assemblies
>>> without issue. Solder mask usually is UV cured hence normal cure
>> processes
>>> shouldn't damage the PCB at minimum.
>>> Contacted several UV coating and equipment manufacturers but
>>> nothing
>>> useful came out of that.
>>> Nothing in IPC CC830 Handbook either.
>>>
>>> I am looking for reports/thoughts that anyone may have , which
>>> supports
>>> or disputes this claim.
>>> Any components know to be UV sensitive?
>>>
>>> Thanks in advance
>>>
>>> Rich Kraszewski /Plexus
>>>
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>
>
>
> --
> Brian Stumm
> ETS, Inc.
> +1-509-276-2015
>
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