You have several options that I know of:
1. Dispense a water-soluble maskant such as Techspray on the vias you do not want to fill with solder, then wave solder all of the other vias that you do want filled. You can also apply kapton tape dots. They come in pretty much any size you wish.
2. Skip the soluble masking or tape dots and just perform selective soldering. If there are vias close by that you do not want filled, mask only those.
3. Simply ask the PWB fabricator to plate shut the vias that you want filled.
4. Apply solder paste on those holes you want filled as part of the solder paste stencil printing process. The holes you want to be filled will require an aperture in the stencil. You can designate which ones you want to print paste onto and your stencil provider can add those apertures only to the stencil, along with the rest of the SMT apertures.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Thursday, March 31, 2016 1:03 PM
To: [log in to unmask]
Subject: [TN] Selective Via fill

Hi All,
Is there a selective via fill process available in the industry- e.g. - fill one via and then not fill another one .020 away on a circuit. Thanks. Steve Kelly

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