Many passive components, also used for hybrid applications (adhesive attachment) had/have Au over Ni termination.

For SMD work, I would not procure that termination if at all possible.



Serhat, you could put a dot of non-conductive adhesive under them, but I still would be concerned about the joint composition ...

Steve C

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Monday, March 28, 2016 7:25 AM
To: [log in to unmask]
Subject: Re: [TN] smd components with gold over nickel barrier

To avoid confusion I believe you are referring to the PCB?? For enig

> On Mar 28, 2016, at 5:17 PM, Serhat Hasipek <[log in to unmask]> wrote:
> 
> Hi to all,
> 
> I need to get an information about reflow profile of  smd components with gold over nickel barrier.  We have encountered tombstoning problem at surface mount capacitances and resistors with gold over nickel barrier. We have applied usual lead free reflow profile with max 245 °C.
> Is there any suggestion to prevent tombstoning at these components except for bonding?
> 
> 
> Best regards
> 
> SERHAT HASİPEK
> 
> 
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