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Date: | Mon, 28 Mar 2016 09:17:11 +0000 |
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Hi to all,
I need to get an information about reflow profile of smd components with gold over nickel barrier. We have encountered tombstoning problem at surface mount capacitances and resistors with gold over nickel barrier. We have applied usual lead free reflow profile with max 245 °C.
Is there any suggestion to prevent tombstoning at these components except for bonding?
Best regards
SERHAT HASİPEK
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